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Description
MM-1650
The MM-1650 combines the industry’s most
powerful System-on-Chip,
CoSine™, with the
application optimized architecture of an
Othello® VME carrier.
Mezzanine Sites
Mezzanine sites on the MM-1650 can support
either PMCs or XMCs. Configured for PMC support,
each PCI bus can operate in 32-bit or 64-bit PCI
2.3 mode at up to 66MHz or in 64-bit PCI-X mode
at up to 133MHz. Configured for XMCs, the sites
can support the
Aurora™ protocol with four MGTs
or Serial
RapidIO x4.
Backplane Connectivity
In addition to having a VME320 2eSST interface,
the MM-1650 is the first VME board to include
complete on-board Serial RapidIO switch fabric
connectivity, with four independent Serial
RapidIO ports to the VITA 46 P1 MGT backplane
connector per the VITA 46.3 draft standard.
LX160 and V-4 Logic Slices
The MM-1650 is the first VME board to include
the V-4™ LX™ series of FPGAs from Xilinx®. The
LX device is notable in the large amount of FPGA
slices that it provides for logic intensive
implementations (see Xilinx V-4 Family
Overview).
It can sometimes be difficult to predict logic
resource utilization requirements in advance of
RTL implementation. The LX family addresses this
concern by offering massive logic densities. In
the Xilinx V-4 portfolio, the LX160 is second in
size only to the LX200. It offers over 67,000
FPGA slices for logic-centric applications
requiring maximum gate count.
While using RTL abstraction tools such as The
MathWork’s Simulink and Xilinx System Generator
can reduce FPGA development time, resulting
compiled VHDL can be verbose and require many
more slices than might otherwise be required
from hand coded state machines. The LX160
counters this concern by providing a large
platform that provides the equivalent of
approximately 15 million ASIC gates.
CoSine Compute Nodes
The MM-1650 contains two independent CoSine
Compute Nodes (CCNs). A single CCN is comprised
of a CoSine Primary Device (V-II Pro™ 2VP70™), a
CoSine Companion Device (V-4 LX160) – see
CoSine
and CoSine Companion Device Configurations – and
the following:
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Two embedded PowerPC 405GP processors
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One multi-ported primary DDR array, up to
1GB, for seamless bus translation between
the mezzanine port and crossbar port to the
backplane
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Two dedicated 128MB DDR arrays local to each
PowerPC processor
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Four independent 9MB QDR II SRAM arrays
local to the LX160 for FPGA processing
operations
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FPGA Platform Flash
Aggregate memory bandwidth exceeds 20GB/s per
CCN, providing a total of over 40 GB/s on the
MM-1650.
PowerPC Processors and Infrastructure
Each of the two embedded PowerPCs in each 2VP70
is a fully functional computer, each with its
own DDR array, programmable Flash, UART, and
shared Ethernet. Processors can host device
drivers, perform message passing, service
interrupts, or execute floating point
operations. Each processor includes a complete
BSP with all internal SoC device drivers fully
integrated so customers can download application
files “out of the box”.
Reconfigurable Processing
Each of the LX160s have additional FPGA platform
Flash to store multiple bitstreams. Because the
principal System-on-Chip functionality is
largely contained in the 2VP70 CoSine Primary
Device, the MM-1650 is optimally designed for
reconfigurable processing. This approach enables
the LX160 CoSine Companion Devices, which
contain User Programmable Logic, to be
reconfigured by the 2VP70 CoSine Primary Devices
without the 2VP70s needing to reconfigure
themselves.
Temperature Sensing
The MM-1650 contains a CPLD that monitors the
temperatures of the CoSine Primary Devices,
CoSine Companion Devices, and primary circuit
board to ensure proper operation. Status updates
can be received by the CoSine PowerPC processors
that can then make intelligent decisions,
display status to user programmable LEDs, or
communicate information over its Ethernet link
to remote destinations.
Debug Ports
Debug ports include four RS-232 UART consoles,
one board/system push button reset switch, and
two processor JTAG debug ports. Debug ports are
available out the front panel or backplane via
P0.
Ruggedized Options
The MM-1650DR is a rugged, extended temperature
air cooled board with an operating temperature
of -40°C to +71°C. The MM-1650DTF is a rugged
conduction cooled board with an operating
temperature of -40°C to +85°C with cabling out
the front panel, and the MM-1650DTB is a rugged
conduction cooled board with an operating
temperature of -40°C to +85°C with cabling onto
the backplane. Both the MM-1650DR, MM-1650DTF,
and MM-1650DTB were designed for optimal heat
dissipation and deployment in environments that
undergo severe shock and vibration.
MM-1650
Spec Sheet.pdf |